MAZELA, W.; CZUB, P.; PIELICHOWSKI, J. Application of epoxy resins in electronics and optoelectronics. Part 1. Mechanical properties and thermal stability of epoxy resins used for encapsulation of electronic devices. Polimery, [S. l.], v. 49, n. 4, p. 233–239, 2022. Disponível em: https://ichp.vot.pl/index.php/p/article/view/1745. Acesso em: 21 nov. 2024.