Mazela, W., P. Czub, and J. Pielichowski. “Application of Epoxy Resins in Electronics and Optoelectronics. Part 1. Mechanical Properties and Thermal Stability of Epoxy Resins Used for Encapsulation of Electronic Devices”. Polimery 49, no. 4 (September 1, 2022): 233–239. Accessed November 21, 2024. https://ichp.vot.pl/index.php/p/article/view/1745.