Chmielewska, D., M. Barczewski, and T. Sterzyński. “A New Method of Curing Epoxy Resin by Using bis(heptaphenylaluminosilsesquioxane) As a Hardener”. Polimery 58, no. 4 (April 30, 2013): 270-275. Accessed April 30, 2024. https://ichp.vot.pl/index.php/p/article/view/732.