Synthesis of a novel phosphorus-containing polysiloxane and its use as the modifier of thermal properties of an epoxy resin

M. Hou; W. Liu; Q. Su; Y. Liu

Published : 2022-08-26

Vol. 52 No. 11-12 (2007)

Synthesis of a novel phosphorus-containing polysiloxane and its use as the modifier of thermal properties of an epoxy resin

M. Hou W. Liu Q. Su Y. Liu

Abstract

A novel epoxy resin modifier, phosphorus-containing epoxide siloxane (PES) with pendant epoxide and cyclic phosphorus groups in the side chains of the polysiloxane backbone, was synthesized via the ring-opening reaction of epoxy siloxane (ES) with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO). 1H NMR and FT-IR measurements were employed to characterize its chemical structure. The PES at various ratios was used to modify a bisphenol A epoxy resin (Ep828) by pre-reaction with curing agent 4,4'-diaminodiphenylmethane (DDM). The cured samples were investigated using differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), thermogravimetric analysis (TGA) and limited oxygen index (LOI). The results showed that the epoxy resins modified with PES exhibited higher glass transition temperatures (Tg), higher initial degradation temperatures (Td 5%) and better flame retardancy than the unmodified.

Keywords

epoksydowany siloksan zawierający atomy fosforu ; żywica epoksydowa ; modyfikacja ; właściwości termiczne ; graniczny indeks tlenowy phosphorus-containing epoxide siloxane ; epoxy resin ; modification ; thermal properties ; limited oxygen index

Details

References

Statistics

Authors

Download files

PDF

Zasady cytowania

Hou, M., Liu, W., Su, Q., & Liu, Y. (2022). Synthesis of a novel phosphorus-containing polysiloxane and its use as the modifier of thermal properties of an epoxy resin. Polimery, 52(11-12), 836–840. Retrieved from https://ichp.vot.pl/index.php/p/article/view/1478

References

Gorczyk J., Bogdal D., Pielichowski J., Penczek P.: Polimery 2006, 51, 781.

2. Wang C. S., Shieh J. Y.: J. Appl. Polym. Sci. 1999, 73, 353.

3. Cai S. X., Lin C. H.: J. Polym. Sci. Part A: Polym. Chem. 2005, 43, 2862.

4. Liu Y. L., Wu C. S., Chiu Y. S., Ho W. H.: J. Polym. Sci. Part A: Polym. Chem. 2003, 41, 2354.

5. Shieh J. Y., Wang C. S.: Polymer 2001, 42, 7617.

6. Kicko-Walczak E., Jankowski P.: Polimery 2005, 50, 860.

7. Liu Y. L., Wu C. S., Hsu K. Y., Chang T. C.: J. Polym. Sci. Part A: Polym. Chem. 2002, 40, 2329.

8. Hsiue G. H., Liu Y. L., Tsaio J.: J. Appl. Polym. Sci. 2000, 78, 1.

9. Morita Y., Tajima S., Suzuki H., Sugino H.: J. Appl. Polym. Sci. 2006, 100, 2010.

10. Hou S. S., Chung Y. P., Chan C. K., Kuo P. L.: Polymer 2000, 41, 3263.

11. Liu Y. L., Chang G. P., Wu C. S.: J. Appl. Polym. Sci. 2006, 102, 1071.

12. Liu Y. L., Chou C. I.: Polym. Degrad. Stab. 2005, 90, 515.

13. Wu C. S., Liu Y. L., Chiu Y. S.: Polymer 2002, 43, 4277.

14. Hussain M., Varley R. J., Zenka M., Simonl G. P.: J. Appl. Polym. Sci. 2003, 90, 3696.

Google Scholar

Altmetric indicators

Citing articles via

Statistics

Total abstract views : 0

PDF Downloads : 0

M. Hou liuwq@gic.ac.cn

Affiliation
Chinese Academy of Sciences, Guangzhou Institute of Chemistry, Key Laboratory of Polymer Materials for Electronics, Guangzhou 510650, P. R. China

W. Liu

Q. Su

Y. Liu