New aromatic diamine-based deep eutectic solvents designed for epoxy resin curing

P. Staciwa; T. Spychaj

doi:10.14314/polimery.2018.6.6

Published : 2021-01-13

Vol. 63 No. 6 (2018)

New aromatic diamine-based deep eutectic solvents designed for epoxy resin curing

P. Staciwa T. Spychaj

DOI: https://doi.org/10.14314/polimery.2018.6.6

Abstract

New deep eutectic solvents (DESs) based on choline chloride (ChCl) and aromatic amines: m-phenylenediamine (MPDA) and 2,4-diaminotoluene (DAT) were prepared for the first time and applied for bisphenol A-based low molecular epoxy resin curing. Some physicochemical features of both DESs were presented and discussed on a basis of literature data. Curing process of epoxy compositions with stoichiometric and substoichiometric amounts of amine hydrogens was characterized via differential scanning calorimetry (DSC). The resulting cured materials possess acceptable thermomechanical properties. Advantages of DES based on ChCl and MPDA allowed to determine possible application areas of this epoxy resin curing agents.

Keywords

deep eutectic solvent ; aromatic diamine ; epoxy resin curing ciecz głęboko eutektyczna ; diamina aromatyczna ; sieciowanie żywicy epoksydowej

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Staciwa, P., & Spychaj, T. (2021). New aromatic diamine-based deep eutectic solvents designed for epoxy resin curing. Polimery, 63(6), 453–457. https://doi.org/10.14314/polimery.2018.6.6

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P. Staciwa help@libcom.pl

Affiliation
West Pomeranian University of Technology, Faculty of Chemical Technology and Engineering, Institute of Inorganic Chemical Technology and Environmental Engineering, Pulaskiego 10, 70-322 Szczecin, Poland

T. Spychaj

Affiliation
West Pomeranian University of Technology, Faculty of Chemical Technology and Engineering, Polymer Institute, Pulaskiego 10, 70-322 Szczecin, Poland